- Branche: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
That portion of the package lead which is inside the package cavity and to which the bonding wire will be connected to make electrical contact with the die.
Industry:Semiconductors
A condition where the output of a circuit has become fixed near one of the two voltage extremes and will no longer react to changes in the input signal. Latchup may be radiation induced, but can also result from voltage overstresses and other causes.
Industry:Semiconductors
A. A torsion test for lead strength. (See lead fatigue). B. The process whereby flatpack leads are reformed to facilitate mounting on a PC board.
Industry:Semiconductors
Application of a repetitive bending force to the leads of sample devices to insure structural integrity of leads and packages.
Industry:Semiconductors
A test which tests the integrity of the seal of a semiconductor device (usually one that employs a glass frit seal) by twisting the package and the lid in opposite but parallel directions.
Industry:Semiconductors
A measure of the horizontal dimensions of surface features of a semiconductor die, such as the separation between gate and drain diffusions on an MOS die.
Industry:Semiconductors
LSI devices are generally accepted to be those that contain between 100 and 1000 gate equivalents, or other circuitry of similar complexity.
Industry:Semiconductors
